Title:
COMPOUND LIFT PIN TIP WITH TEMPERATURE COMPENSATED ATTACHMENT FEATURE
Document Type and Number:
WIPO Patent Application WO/2011/017226
Kind Code:
A3
Abstract:
A method and apparatus for a lift pin is described. In one embodiment, a lift pin head is described. The lift pin head includes a base member having a body made of a first material having a first coefficient of thermal expansion, and a tip disposed on the base member, the base member having a body made of a second material that is flexible at room temperature and having a second coefficient of thermal expansion, the first coefficient of thermal expansion being less than the second coefficient of thermal expansion.
Inventors:
POLYAK ALEXANDER S (US)
CHO TOM K (US)
GOMEZ OSCAR (US)
CHO TOM K (US)
GOMEZ OSCAR (US)
Application Number:
PCT/US2010/043956
Publication Date:
June 16, 2011
Filing Date:
July 30, 2010
Export Citation:
Assignee:
APPLIED MATERIALS INC (US)
POLYAK ALEXANDER S (US)
CHO TOM K (US)
GOMEZ OSCAR (US)
POLYAK ALEXANDER S (US)
CHO TOM K (US)
GOMEZ OSCAR (US)
International Classes:
H01L21/68; G02F1/13; H01L21/683
Foreign References:
| US7081165B2 | 2006-07-25 | |||
| US6375748B1 | 2002-04-23 | |||
| US6676761B2 | 2004-01-13 | |||
| US6887317B2 | 2005-05-03 |
Attorney, Agent or Firm:
PATTERSON, B. Todd et al. (L.L.P.3040 Post Oak Blvd., Suite 150, Houston Texas, US)
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