COMPOUND, METHOD FOR PRODUCING COMPOUND, ADHESIVE COMPOSITION AND ADHESIVE TAPE

WIPO Patent Application WO/2022/045306

A1

One purpose of the present invention is to provide a compound which is capable of enhancing the bonding strength of an adhesive composition, especially the bonding strength thereof to an adherend with low polarity. Another purpose of the present invention is to provide: a method for producing this compound; an adhesive composition which contains this compound; and an adhesive tape which has an adhesive layer that contains this adhesive composition. The present invention provides a compound which has at least one constituent unit (A) that is selected from the group consisting of a constituent unit (A-1) and a constituent unit (A-1') represented by the formulae. In the formulae, each R1 represents a hydrogen atom, an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a polar functional group, an aliphatic hydrocarbon group having a polar functional group, or an aromatic hydrocarbon group having a polar functional group; n represents an integer from 2 to 4; and n' represents an integer from 2 to 5.

SHIMOJITOSHO AKIRA (JP)
OGATA YUDAI (JP)

PCT/JP2021/031582

March 03, 2022

August 27, 2021

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SEKISUI CHEMICAL CO LTD (JP)

C07C39/15; C08G61/02; C08L33/04; C08L45/00; C08L53/02; C08L57/02; C08L65/00; C08L93/04; C09J11/08; C09J133/00; C09J153/02

WO2021112194A1	2021-06-10
WO2004067601A1	2004-08-12

JP2001261793A	2001-09-26
JP2015026033A	2015-02-05
JP2013015642A	2013-01-24
JP2015196709A	2015-11-09
JP2015052050A	2015-03-19
JP2015021067A	2015-02-02
JP2015120876A	2015-07-02

YASUTOMI & ASSOCIATES (JP)

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