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Patent Searching and Data


Title:
COMPOUND POWDER
Document Type and Number:
WIPO Patent Application WO/2019/167182
Kind Code:
A1
Abstract:
Provided is a compound powder suitable for producing molded objects having a high density. The compound powder 10 comprises metal-element-containing particles 1 and a resin composition 2 which covers the metal-element-containing particles 1, the resin composition 2 having a melt viscosity at 100°C of 0.01-10 Pa·s.

Inventors:
TAKEUCHI KAZUMASA (JP)
ISHIHARA CHIO (JP)
MAEDA HIDEO (JP)
ITOH TERUO (JP)
SAWAMOTO HAYATO (JP)
AIBA KOHEI (JP)
Application Number:
PCT/JP2018/007578
Publication Date:
September 06, 2019
Filing Date:
February 28, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B22F1/08; B22F1/102; B22F1/16; B22F3/00; C08K3/013; C08K3/08; C08K3/10; C08K9/04; H01F1/08; H01F1/26
Foreign References:
JPS487687U1973-01-27
JPS6270454A1987-03-31
JP2003178624A2003-06-27
JPS58167624A1983-10-03
JP2015183093A2015-10-22
JP2001329226A2001-11-27
JPH0645125A1994-02-18
JPS61184804A1986-08-18
JP2002110411A2002-04-12
JPS62282418A1987-12-08
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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