Title:
COMPOUND POWDER
Document Type and Number:
WIPO Patent Application WO/2019/167182
Kind Code:
A1
Abstract:
Provided is a compound powder suitable for producing molded objects having a high density. The compound powder 10 comprises metal-element-containing particles 1 and a resin composition 2 which covers the metal-element-containing particles 1, the resin composition 2 having a melt viscosity at 100°C of 0.01-10 Pa·s.
Inventors:
TAKEUCHI KAZUMASA (JP)
ISHIHARA CHIO (JP)
MAEDA HIDEO (JP)
ITOH TERUO (JP)
SAWAMOTO HAYATO (JP)
AIBA KOHEI (JP)
ISHIHARA CHIO (JP)
MAEDA HIDEO (JP)
ITOH TERUO (JP)
SAWAMOTO HAYATO (JP)
AIBA KOHEI (JP)
Application Number:
PCT/JP2018/007578
Publication Date:
September 06, 2019
Filing Date:
February 28, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; B22F1/08; B22F1/102; B22F1/16; B22F3/00; C08K3/013; C08K3/08; C08K3/10; C08K9/04; H01F1/08; H01F1/26
Foreign References:
JPS487687U | 1973-01-27 | |||
JPS6270454A | 1987-03-31 | |||
JP2003178624A | 2003-06-27 | |||
JPS58167624A | 1983-10-03 | |||
JP2015183093A | 2015-10-22 | |||
JP2001329226A | 2001-11-27 | |||
JPH0645125A | 1994-02-18 | |||
JPS61184804A | 1986-08-18 | |||
JP2002110411A | 2002-04-12 | |||
JPS62282418A | 1987-12-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: