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Title:
COMPOUND POWDER,COMPACT, BONDED MAGNET, AND DUST CORE
Document Type and Number:
WIPO Patent Application WO/2023/157139
Kind Code:
A1
Abstract:
This compound powder (10) contains a metal powder and an aminophenyl adduct of a bismaleimide. A coating layer 4 containing the aminophenyl adduct of a bismaleimide coats the surfaces of at least some of the metal particles 2 constituting the metal powder.

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Inventors:
TAIRA ARISA (JP)
TAKEUCHI KAZUMASA (JP)
ITOH TERUO (JP)
URASHIMA KOSUKE (JP)
Application Number:
PCT/JP2022/006223
Publication Date:
August 24, 2023
Filing Date:
February 16, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
B22F1/102
Foreign References:
JPH1126222A1999-01-29
JP2010174062A2010-08-12
JP2005082628A2005-03-31
JP2003168602A2003-06-13
JP7020602B12022-02-16
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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