Title:
COMPOUND POWDER,COMPACT, BONDED MAGNET, AND DUST CORE
Document Type and Number:
WIPO Patent Application WO/2023/157398
Kind Code:
A1
Abstract:
Provided is a compound powder that increases the high-temperature mechanical strength of products produced from the compound powder. The compound powder contains a metal powder (a plurality of metal particles) and a maleimide compound that a bismaleimide and/or an aminophenyl adduct of a bismaleimide. The compound powder may further contain a silicon compound. The silicon compound may have a functional group containing a carbon-carbon double bond.
Inventors:
TAIRA ARISA (JP)
TAKEUCHI KAZUMASA (JP)
KONDO HIROAKI (JP)
ITOH TERUO (JP)
OGAWA TETSUYA (JP)
URASHIMA KOSUKE (JP)
TAKEUCHI KAZUMASA (JP)
KONDO HIROAKI (JP)
ITOH TERUO (JP)
OGAWA TETSUYA (JP)
URASHIMA KOSUKE (JP)
Application Number:
PCT/JP2022/041754
Publication Date:
August 24, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B22F1/102
Domestic Patent References:
| WO2019106812A1 | 2019-06-06 |
Foreign References:
| JPH1126222A | 1999-01-29 | |||
| JP2010174062A | 2010-08-12 | |||
| JP2005082628A | 2005-03-31 | |||
| JP2003168602A | 2003-06-13 | |||
| JP2014072367A | 2014-04-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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