Title:
COMPOUND, RADIATION-SENSITIVE COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN
Document Type and Number:
WIPO Patent Application WO/2012/014435
Kind Code:
A1
Abstract:
[Problem] To provide a compound which has a high solubility in a safe solvent, is highly sensitive, and produces a good resist pattern shape; a radiation-sensitive composition containing the compound; and a method for forming a resist pattern using the composition.
[Solution] A compound (B) obtained by reacting a cyclic polyphenolic compound (A) with a compound (C) having a specific structure; a radiation-sensitive composition containing the compound (B); and a method for forming a resist pattern using the composition.
Inventors:
ECHIGO, Masatoshi (INC. Hiratsuka Research Laboratory, 6-2, Higashiyawata 5-chome, Hiratsuka-sh, Kanagawa 16, 〒2540016, JP)
Application Number:
JP2011/004179
Publication Date:
February 02, 2012
Filing Date:
July 25, 2011
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC. (5-2 Marunouchi 2-chome, Chiyoda-ku Tokyo, 24, 〒1008324, JP)
三菱瓦斯化学株式会社 (〒24 東京都千代田区丸の内２－５－２ Tokyo, 〒1008324, JP)
三菱瓦斯化学株式会社 (〒24 東京都千代田区丸の内２－５－２ Tokyo, 〒1008324, JP)
International Classes:
C08G65/38; G03F7/004; G03F7/039; H01L21/027
Attorney, Agent or Firm:
SUGIMURA, Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigaseki, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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Claims: