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Title:
COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/016614
Kind Code:
A1
Abstract:
This compound is represented by formula (0).

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Inventors:
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2017/026412
Publication Date:
January 25, 2018
Filing Date:
July 21, 2017
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C07C69/54; C07C43/215; C07D311/80; C07D311/90; C08F216/10; C08F224/00; G03F7/031; G03F7/11; G03F7/20; G03F7/26
Domestic Patent References:
WO2015137486A12015-09-17
Foreign References:
JP2010160300A2010-07-22
CN102778814A2012-11-14
JP2003012660A2003-01-15
JP2001125474A2001-05-11
JPH04253716A1992-09-09
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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