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Patent Searching and Data


Title:
COMPOUND STRUCTURE EQUIPPED WITH RESIN STRUCTURE AND METAL PLATE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2013/047700
Kind Code:
A1
Abstract:
A method for manufacturing a compound structure for which a resin structure (2) and a metal plate (3) are bonded together using an adhesive agent (5), wherein the resin structure (2) is equipped with multiple erect bodies (8) by means of wall parts (7) rising from the surface of the base part (15) of the resin structure (2), and the adhesive agent (5) is applied to the face of the metal plate (3) which is to be bonded to the resin structure (2), with the metal plate being heated to at least the melting point of the resin structure (2) and the erect-body side of the resin structure (2) being brought into contact with the face of the heated metal plate (3) to which the adhesive agent has been applied, after which pressure is applied to the metal plate (3) and the resin structure (2) from the outside, pressure-bonding the wall tip-end parts (9) of the erect bodies (8) of the resin structure (2) to the metal plate (3) via the adhesive agent (5). Thus, the wall tip-end parts (9) are melted and the resin structure (2) and the metal plate (3) are fused together by adhering the wall tip-end parts (9), the adhesive agent (5), and the metal plate (3), without melting of the surface of the base part (15) due to the heat of the metal plate (3).

Inventors:
YURA SHIGEO (JP)
KIMURA HIDENARI (JP)
OMIYA HIKAMITSU (JP)
SANO SHOTARO (JP)
HAYASAKA YASUNORI (JP)
Application Number:
PCT/JP2012/074964
Publication Date:
April 04, 2013
Filing Date:
September 27, 2012
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN METAL PRODUCTS CO LTD (JP)
International Classes:
B32B3/26; B32B15/08
Foreign References:
JPS635936A1988-01-11
JPS55156052A1980-12-04
JPS5762026U1982-04-13
JPS56142052A1981-11-06
JP2004504159A2004-02-12
JPS62150131U1987-09-22
JPS5779797A1982-05-19
JPS3512940B1
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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Claims: