Title:
COMPOUND
Document Type and Number:
WIPO Patent Application WO/2017/171490
Kind Code:
A2
Abstract:
The present application relates to a curable composition, a cured body, and uses of the curable composition and the cured body. The present application can provide a curable composition, which, by containing a curable compound having a particular structure, can enhance the cohesive strength of a cured material without an increase in the viscosity of the composition before curing, minimize an increase in the elastic modulus of the cured material, improve the interfacial adhesive strength, and minimize the proportion of non-reactive oligomers. The curable composition can be applied to various optical uses, and for example, the curable composition can be advantageously used for direct bonding of various optical functional members of a display device, such as direct bonding between a touch panel and a display panel.
More Like This:
Inventors:
LEE JI YEONG (KR)
HWANG JI YOUNG (KR)
YANG SE WOO (KR)
HWANG JI YOUNG (KR)
YANG SE WOO (KR)
Application Number:
PCT/KR2017/003576
Publication Date:
October 05, 2017
Filing Date:
March 31, 2017
Export Citation:
Assignee:
LG CHEMICAL LTD (KR)
International Classes:
C08L71/02; C08G65/34; C09D171/02
Foreign References:
| JP2005055641A | 2005-03-03 |
Other References:
See also references of EP 3421542A4
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
Download PDF: