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Title:
COMPOUNDS CONTAINING AUTHENTICATION ADDITIVES
Document Type and Number:
WIPO Patent Application WO/2020/057364
Kind Code:
A1
Abstract:
Covert or forensic authentication of polymer articles is possible by using a thermoplastic compound containing at least one inorganic chemical additive having metal which is identifiable using ICP-MS.

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Inventors:
WANG JIWEN (CN)
LIU MENGGE (CN)
Application Number:
PCT/CN2019/104157
Publication Date:
March 26, 2020
Filing Date:
September 03, 2019
Export Citation:
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Assignee:
POLYONE SHANGHAI CHINA (CN)
International Classes:
C08K3/00; C08K3/08; C08K3/22; C08L23/06; C08L23/12; C08L25/06; C08L33/00; C08L55/02; C08L67/00; C08L69/00; C08L75/04; C08L77/00; C08L81/02; G01N23/22
Domestic Patent References:
WO2008003309A22008-01-10
Foreign References:
CN1978522A2007-06-13
CN102301403A2011-12-28
DE102013013108A12015-02-12
EP1110996A12001-06-27
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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