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Title:
COMPRESSION BONDED SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/042664
Kind Code:
A1
Abstract:
A compression bonded semiconductor device used for a large capacity converter for driving a rolling mill for paper-making/steel-manufacturing in which a GCT can be easily attached/detached to/from a gate driver, wherein a second stacked electrode (47) is extended under a connection section (38b) where an external gate terminal (38) and a platelike control-gate electrode (48) are electrically connected, and a support member (53) being concentrical with the external gate terminal (38) between the connection section (38b) and the second stacked electrode (47) and having a second elastic body (54) pressing the connection section (38b) is disposed.

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Inventors:
KAWAMURA TOSHINOBU (JP)
SATOH KATSUMI (JP)
Application Number:
PCT/JP1999/000120
Publication Date:
July 20, 2000
Filing Date:
January 18, 1999
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
KAWAMURA TOSHINOBU (JP)
SATOH KATSUMI (JP)
International Classes:
H01L23/48; (IPC1-7): H01L29/74
Foreign References:
JPH10270475A1998-10-09
JPS6232555U1987-02-26
Other References:
See also references of EP 1065730A4
Attorney, Agent or Firm:
Miyata, Kaneo (Marunouchi 2-chome Chiyoda-ku Tokyo, JP)
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