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Patent Searching and Data


Title:
COMPRESSION HEAD, COMPOSITE-MATERIAL MOLDING DEVICE, AND COMPOSITE-MATERIAL MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/150769
Kind Code:
A1
Abstract:
Provided are a compression head for reducing the occurrence of temperature unevenness in a composite material during heating, a composite-material molding device, and a composite-material molding method. A compression head 20 is provided on the other side of a pre-reaction composite material 2 from a magnetic field coil 30 provided on one side of the composite material 2, the compression head 20 facing the magnetic field coil 30 via the composite material 2. The compression head 20 has a compression head body 22 and a high-thermal-conductivity-material layer 24. The compression head body 22 is formed from a material that is transparent to a magnetic field 32 applied by the magnetic field coil 30. The high-thermal-conductivity-material layer 24 is formed on the side of the compression head body 22 that faces the composite material 2, and is transparent to the magnetic field 32 applied by the magnetic field coil 30 and is formed from a material having higher thermal conductivity than the composite material 2.

Inventors:
KAMIHARA NOBUYUKI (JP)
YAMAGUCHI KENGO (JP)
TAKAGI KIYOKA (JP)
ABE TOSHIO (JP)
MURAOKA MIKIO (JP)
Application Number:
PCT/JP2018/045303
Publication Date:
August 08, 2019
Filing Date:
December 10, 2018
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
UNIV AKITA (JP)
International Classes:
B29C43/36; B29C70/54; B29C70/06; B29C70/42; H05B6/10
Domestic Patent References:
WO2017183467A12017-10-26
WO2012133406A12012-10-04
Foreign References:
JP2013154625A2013-08-15
JPH0358809A1991-03-14
JP2014116293A2014-06-26
Other References:
See also references of EP 3733390A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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