Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPRESSION HEAD AND MOUNTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/054284
Kind Code:
A1
Abstract:
Provided are a compression head and a mounting device capable of causing an appropriate pressing pressure to act on an electronic component and absorbing a height variation among electronic components to prevent damage, and capable of improving mounting efficiency by reducing the frequency of replacement. Specifically, a compression head 14 to be provided to a mounting device includes an elastic member 19 interposed between a head body 16 and a pressing member 17. A plate-shaped displacement preventing member 20 is provided between the elastic member 19 and the head body 16. A plate-shaped displacement preventing member 21 is provided between the elastic member 19 and the pressing member 17. The displacement preventing members 20 and 21 are made of materials having strong adhesiveness with the elastic member 19, and hence a stronger frictional force is generated on a contact surface between the elastic member 19 and the head body 16 and a contact surface between the elastic member 19 and the pressing member 17. Consequently, the elastic member 19 can be prevented from being displaced while sliding along the contact surfaces in a direction perpendicular to the pressing direction.

Inventors:
JINDA TOSHIYUKI (JP)
IMAI KOICHI (JP)
TERADA KATSUMI (JP)
SENDA MASAFUMI (JP)
Application Number:
PCT/JP2018/033135
Publication Date:
March 21, 2019
Filing Date:
September 07, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L21/60; H01L21/603
Domestic Patent References:
WO2016031806A12016-03-03
Foreign References:
JP2007294607A2007-11-08
JP2015170646A2015-09-28
JP2011009357A2011-01-13
JP2010034423A2010-02-12
Download PDF: