Title:
COMPRESSION MOLDING DEVICE, COMPRESSION MOLDING METHOD, AND METHOD FOR PRODUCING COMPRESSION-MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/100808
Kind Code:
A1
Abstract:
Provided is a compression molding device that makes it possible to easily suppress variation in package thickness. The compression molding device includes a mold (10) comprising: an upper mold (100) to which a substrate (1) is fixed; a lower mold comprising a mold cavity (204) to which a resin material is supplied; a positioning mechanism (207) that maintains the depth of the mold cavity (204) at a predetermined depth during mold clamping; a surplus resin accommodation section (205) for accommodating surplus resin not accommodated within the mold cavity (204) during mold clamping; and a surplus resin separating member (103). Leakage of resin from the end surface of the substrate (1) is suppressed or prevented during mold clamping of the upper mold (100) and the lower mold (200) as a result of at least part of the end surface of the substrate (1) on the surplus resin accommodation section (205) side being brought into contact with the surplus resin separating member (103). After curing of the resin within the mold cavity (204) and the surplus resin, the resin cured within the mold cavity (204) and the surplus resin cured within the surplus resin accommodation section (205) are separated as a result of the surplus resin separating member (103) raising or lowering one or both of the upper mold (100) and the lower mold (200) relative to one another.
Inventors:
TAMURA TAKASHI (JP)
Application Number:
PCT/JP2017/028753
Publication Date:
June 07, 2018
Filing Date:
August 08, 2017
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B29C43/36; B29C33/12; B29C43/18; B29C43/34; H01L21/56
Foreign References:
| JPH07205191A | 1995-08-08 | |||
| JP2010125647A | 2010-06-10 |
Attorney, Agent or Firm:
TSUJIMARU Koichiro et al. (JP)
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