Title:
COMPUND FOR BONDED MAGNETS, MOLDED BODY AND BONDED MAGNET
Document Type and Number:
WIPO Patent Application WO/2022/014593
Kind Code:
A1
Abstract:
The present invention provides a compound for bonded magnets, said compound enhancing the mechanical strength (for example, crushing strength) of a bonded magnet. This compound for bonded magnets comprises a magnetic powder, an epoxy resin, a curing agent, a coupling agent and a metal salt; and the metal salt is represented by R2M, wherein R represents a saturated fatty acid group having from 6 to 10 carbon atoms, and M represents at least one metal element that is selected from among Ca and Ba.
Inventors:
TAKEUCHI KAZUMASA (JP)
ITOH TERUO (JP)
TAIRA ARISA (JP)
URASHIMA KOSUKE (JP)
ITOH TERUO (JP)
TAIRA ARISA (JP)
URASHIMA KOSUKE (JP)
Application Number:
PCT/JP2021/026302
Publication Date:
January 20, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B22F1/00; B22F3/00; C08G59/20; C08K5/09; C08K5/54; C08L63/00; H01F1/057; H01F1/08
Foreign References:
| JP2005163075A | 2005-06-23 | |||
| JP2001160505A | 2001-06-12 | |||
| JP2013253219A | 2013-12-19 | |||
| JP2004014986A | 2004-01-15 | |||
| JP2011142301A | 2011-07-21 | |||
| JPH08273916A | 1996-10-18 | |||
| JP2001214054A | 2001-08-07 | |||
| JP2004031786A | 2004-01-29 | |||
| JP2012209484A | 2012-10-25 |
Other References:
See also references of EP 4137249A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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