Title:
CONDENSER MICROPHONE STRUCTURE APPROPRIATE FOR VACUUM SUCTION MOUNTING, AND MOUNTING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2012/081772
Kind Code:
A1
Abstract:
The present invention relates to a condenser microphone structure appropriate for vacuum suction mounting, and a mounting method of the condenser microphone structure. A condenser microphone according to the present invention includes a case and a PCB. The case having a sound hole is coupled to the PCB to form an accommodating space therein, so that parts can be mounted in the accommodating space. Since the PCB has an air communication hole, when the case is suctioned through a vacuum suction process, external air is suctioned through the air communication hole to protect the parts mounted in the accommodating space. The air communication hole may be formed in any one of the connecting terminals formed on an exposed surface of the PCB. When the condenser microphone is mounted on a main board of an electronic product, the air communication hole is automatically closed. Since the PCB has the air communication hole, when a pickup module of a chip mounter suctions the condenser microphone, inner parts of the condenser microphone can be protected from suction force. In particular, when the air communication hole is formed in a connecting terminal of the PCB, the condenser microphone may be mounted, for example, on a main board of a cellular phone through a vacuum suction process, and then, the connecting terminal may be soldered to the main board through a reflow process. At this point, the air communication hole can be automatically and simply closed without performing a separate process for closing an air communication hole.
Inventors:
LEE SANG-HO (KR)
SHIM YONG-HYUN (KR)
SHIM YONG-HYUN (KR)
Application Number:
PCT/KR2011/002618
Publication Date:
June 21, 2012
Filing Date:
April 13, 2011
Export Citation:
Assignee:
BSE CO LTD (KR)
TIANJIN BSE ELECTRONICS CO LTD (CN)
DONGGUAN BAOXING ELECTRONICS (CN)
RONGCHENG BAOXING ELECTRONIC CO LTD (CN)
LEE SANG-HO (KR)
SHIM YONG-HYUN (KR)
TIANJIN BSE ELECTRONICS CO LTD (CN)
DONGGUAN BAOXING ELECTRONICS (CN)
RONGCHENG BAOXING ELECTRONIC CO LTD (CN)
LEE SANG-HO (KR)
SHIM YONG-HYUN (KR)
International Classes:
H04R19/04; H04R31/00
Foreign References:
| JPH11317998A | 1999-11-16 | |||
| JP2000310990A | 2000-11-07 | |||
| KR20060119278A | 2006-11-24 | |||
| KR20080092101A | 2008-10-15 | |||
| KR100737726B1 | 2007-07-10 |
Attorney, Agent or Firm:
YOON, Byung-Sam et al. (KR)
윤병삼 (KR)
윤병삼 (KR)
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Claims: