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Title:
CONDUCTIVE ADHESION PREVENTING FILM FOR MEDICAL USE AND MEDICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/088306
Kind Code:
A1
Abstract:
This conductive adhesion preventing film (1B) comprises: a base material (4); and a linear conductor (5) which is contained in an amount of from 5% by mass to 40% by mass (inclusive), while having a length of 10 μm or more and a diameter of more than 50 nm. This conductive adhesion preventing film (1B) is formed on the surface of a medical device.

Inventors:
MURANO YU (JP)
FUJIHARA TAKUYA (JP)
KASAI HIROAKI (JP)
DEGUCHI TAKESHI (JP)
Application Number:
PCT/JP2017/039579
Publication Date:
May 17, 2018
Filing Date:
November 01, 2017
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B18/14; H01B1/00; H01B1/22
Domestic Patent References:
WO2015005204A12015-01-15
WO2017130383A12017-08-03
WO2017145842A12017-08-31
Foreign References:
JP2010227462A2010-10-14
US20150044488A12015-02-12
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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