CONDUCTIVE ADHESIVE AGENT COMPOSITION - TANAKA PRECIOUS METAL IND

Title:

CONDUCTIVE ADHESIVE AGENT COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2020/145170

Kind Code:

A1

Abstract:

The present invention relates to a conductive adhesive agent composition which comprises (A) a conductive filler comprising (a1) metal particles having an average particle diameter of 0.5 to 10 μm and (a2) silver particles having an average particle diameter of 10 to 200 nm and (B) particles of a thermoplastic resin which have an average particle diameter of 2 to 14 μm, wherein the melting point of the thermoplastic resin is 130 to 250°C.

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Inventors:

ABE SHINTAROH (SG)
KONDO TAKESHI (JP)

Application Number:

PCT/JP2019/051028

Publication Date:

July 16, 2020

Filing Date:

December 25, 2019

Export Citation:

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Assignee:

TANAKA PRECIOUS METAL IND (JP)

International Classes:

C09J9/02; C09J11/04; C09J11/08; C09J201/00; H01B1/00; H01B1/22; H01L21/52

Domestic Patent References:

WO2016063931A1	2016-04-28
WO2018181625A1	2018-10-04

Foreign References:

JP2017071707A	2017-04-13
JP2013541611A	2013-11-14

Attorney, Agent or Firm:

EIKOH PATENT FIRM, P.C. (JP)

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