Title:
CONDUCTIVE ADHESIVE COATING METHOD FOR ARRAY SUBSTRATE, AND GLUEING DEVICE AND GLUEING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/223429
Kind Code:
A1
Abstract:
A conductive adhesive coating method for an array substrate, and a glueing device and a glueing system. The glueing device comprises: a driving device; a container (100), which is used for containing a flowable conductive adhesive, wherein a feed port (102) is provided on a side wall of the container, and a discharge port (104) is provided at the bottom of the container; a striker (200), which is located in the container and is driven by the driving device to reciprocate between a first position and a second position, wherein when the striker is located at the first position, the striker plugs the discharge port, and when the striker is located at the second position, the striker is detached from the discharge port so that the flowable conductive adhesive can flow out from the discharge port.
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Inventors:
CHIEN CHUNG-KUANG (CN)
Application Number:
PCT/CN2017/089668
Publication Date:
December 13, 2018
Filing Date:
June 23, 2017
Export Citation:
Assignee:
HKC CORP LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
CHONGQING HKC OPTOELECTRONICS TECH CO LTD (CN)
International Classes:
B05C5/02; B05C5/00
Foreign References:
| CN203556505U | 2014-04-23 | |||
| CN205731823U | 2016-11-30 | |||
| CN102009027A | 2011-04-13 |
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (CN)
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