Title:
CONDUCTIVE ADHESIVE COMPOSITION, ELECTRONIC DEVICE, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/053373
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an electronic device in which a conductive layer has excellent adhesiveness and low surface resistivity, and a production method therefor. The problem is solved by a conductive adhesive composition, an electronic device, and a production method for the electronic device. The conductive adhesive composition contains a conductive organic polymer compound and a water-based emulsion adhesive. The electronic device comprises an anodic layer, a conductive layer formed from the conductive adhesive composition, a photoelectric conversion layer, and a cathode layer arranged in said order, and is characterized in that the conductive adhesive composition is a water-based emulsion adhesive composition containing a conductive organic polymer compound. The production method for the electronic device is characterized by including: a step of forming an anode laminate by forming, on an anodic layer, a conductive layer using the conductive adhesive composition; a step of forming a cathode laminate by forming the photoelectric conversion layer on a cathode layer; and a step of adhering the surface of the photoelectric conversion layer of the cathode laminate to the surface of the conductive layer of the anode laminate.
Inventors:
MUTO TSUYOSHI (JP)
UEMURA KAZUE (JP)
KATO KUNIHISA (JP)
UEMURA KAZUE (JP)
KATO KUNIHISA (JP)
Application Number:
PCT/JP2011/073143
Publication Date:
April 26, 2012
Filing Date:
October 06, 2011
Export Citation:
Assignee:
LINTEC CORP (JP)
MUTO TSUYOSHI (JP)
UEMURA KAZUE (JP)
KATO KUNIHISA (JP)
MUTO TSUYOSHI (JP)
UEMURA KAZUE (JP)
KATO KUNIHISA (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/08; C09J133/04; H01B1/12; H01B1/20; H01L51/42; H01L51/50; H05B33/26; H05B33/28
Domestic Patent References:
| WO2009070504A2 | 2009-06-04 |
Foreign References:
| JPS59227966A | 1984-12-21 | |||
| JPH02115290A | 1990-04-27 | |||
| JPH03227386A | 1991-10-08 | |||
| JP2008106243A | 2008-05-08 | |||
| JP2010163586A | 2010-07-29 | |||
| JP2007051173A | 2007-03-01 | |||
| JP2009500832A | 2009-01-08 | |||
| JP2007204689A | 2007-08-16 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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Claims: