CONDUCTIVE ADHESIVE COMPOSITION AND PREPARATION METHOD THEREFOR, FRAME SEALING ADHESIVE AND DISPLAY PANEL

Title:

CONDUCTIVE ADHESIVE COMPOSITION AND PREPARATION METHOD THEREFOR, FRAME SEALING ADHESIVE AND DISPLAY PANEL

Document Type and Number:

WIPO Patent Application WO/2016/169190

Kind Code:

A1

Abstract:

Embodiments of the present invention relate to the technical field of display. Provided are a conductive adhesive composition and a preparation method therefor, a frame sealing adhesive and a display panel. The dispersion uniformity of conductive particles in an adhesive body can be improved accordingly, and it is ensured that a conductive adhesive composition has more excellent conductivity; and when the doping ratio of conductive particles is high, normal throughput during coating of an adhesive body will not be influenced. The conductive adhesive composition comprises a main body adhesive material and carrier particles dispersed in the main body adhesive material and adsorbed with conductive particles. The present invention is applicable to preparation of a conductive adhesive composition, and a frame sealing adhesive and a display panel comprising the conductive adhesive composition.

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Inventors:

ZHOU YONGSHAN (CN)
QIN YIFENG (CN)

Application Number:

PCT/CN2015/089525

Publication Date:

October 27, 2016

Filing Date:

September 14, 2015

Export Citation:

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Assignee:

BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE OPTOELECTRONICS TECH CO LTD (CN)

International Classes:

C09J11/06; C09J9/02; C09J133/00; C09J201/00; G02F1/1339

Foreign References:

CN104845548A	2015-08-19
CN103642422A	2014-03-19
US20080131685A1	2008-06-05
JP4848674B2	2011-12-28
CN102714071A	2012-10-03

Other References:

LIN, WEI: "Study on Novel Modified Graphite/Epoxy Resin Conductive Adhesives", CNKI MASTER'S THESES DATABASE, 1 April 2009 (2009-04-01)

Attorney, Agent or Firm:

CHINA PATENT AGENT (H.K.) LTD. (CN)
中国专利代理(香港)有限公司 (CN)

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