Title:
CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/151188
Kind Code:
A1
Abstract:
Provided is a conductive adhesive composition that is capable of being worked at no more than 120°C and has both isotropic conductivity and excellent adhesion properties. The conductive adhesive composition contains 50–300 parts by mass of a dendrite-shaped conductive filler, relative to 100 parts by mass of a resin component containing at least: a crystalline thermoplastic resin (A) having a melting point of at least 100°C; an amorphous thermoplastic resin (B); and a carboxyl group modified polyester resin (C).
Inventors:
TAKAHASHI AKIO (JP)
Application Number:
PCT/JP2019/002763
Publication Date:
August 08, 2019
Filing Date:
January 28, 2019
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C09J201/00; C09J9/02; C09J11/04; C09J167/00; H01B1/22
Foreign References:
| JP2015521214A | 2015-07-27 | |||
| US5837119A | 1998-11-17 | |||
| JPH1112552A | 1999-01-19 | |||
| JP2007031602A | 2007-02-08 | |||
| JP2014060025A | 2014-04-03 | |||
| JPH03131679A | 1991-06-05 | |||
| EP3236479A1 | 2017-10-25 |
Attorney, Agent or Firm:
TSUTADA, Masato et al. (JP)
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