Title:
CONDUCTIVE ADHESIVE FILM HAVING EXCELLENT HEAT RESISTANCE AND MOISTURE RESISTANCE
Document Type and Number:
WIPO Patent Application WO/2019/066225
Kind Code:
A1
Abstract:
The present invention relates to a conductive adhesive film having excellent heat resistance and moisture resistance, and has an adhesive layer, which is made of a conductive adhesive composition comprising 100 parts by weight of a polyamide resin represented by chemical formula 1, 100-400 parts by weight of a conductive metal and 0.1-5 parts by weight of a siloxane compound, and is layered on the surface of a substrate, thereby improving the heat resistance of an adhesive film, facilitates curing with the siloxane compound, thereby improving moisture resistance, and has improved long-term reliability of the heat resistance and moisture resistance.
Inventors:
KIM BYUNG SUN (KR)
Application Number:
PCT/KR2018/008106
Publication Date:
April 04, 2019
Filing Date:
July 18, 2018
Export Citation:
Assignee:
JHC CO LTD (KR)
International Classes:
C09J9/02; C09J7/20; C09J11/04; C09J177/00
Domestic Patent References:
| WO2004067666A1 | 2004-08-12 |
Foreign References:
| KR20150067060A | 2015-06-17 | |||
| JP2006169456A | 2006-06-29 | |||
| KR20090027193A | 2009-03-16 | |||
| JP2012007066A | 2012-01-12 |
Attorney, Agent or Firm:
KANG, Hyeong Seok (KR)
Download PDF:
Previous Patent: METHOD FOR OLEFIN OLIGOMERIZATION
Next Patent: ELECTRONIC DEVICE WITH OPTICAL SENSOR
Next Patent: ELECTRONIC DEVICE WITH OPTICAL SENSOR