Title:
CONDUCTIVE ADHESIVE MATERIAL-FORMING COMPOSITION, CONDUCTIVE ADHESIVE MATERIAL, DEVICE, AND METHOD FOR PRODUCING CONDUCTIVE ADHESIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/070339
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a conductive adhesive material-forming composition, with which a conductive adhesive material having high conductivity and bonding strength can be formed; a conductive adhesive material; a device; and a method for producing a conductive adhesive material. The conductive adhesive material-forming composition according to the present invention contains: a solvent; and at least one conductive material selected from the group consisting of metal nanowires and metal nanowire aggregates, wherein the specific surface area of the conductive material per unit mass is 100-50,000 m2/kg, and the content of the conductive material is at least 30 mass%.
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Inventors:
KAWAGUCHI JUNJI (JP)
Application Number:
PCT/JP2023/030238
Publication Date:
April 04, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B1/22; H01B5/00; H01B13/00
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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