Title:
CONDUCTIVE ADHESIVE, RAW MATERIAL COMPOSITION, ELECTRONIC ELEMENT, AND PREPARATION METHOD AND APPLICATION
Document Type and Number:
WIPO Patent Application WO/2020/020334
Kind Code:
A1
Abstract:
A conductive adhesive, a raw material composition, an electronic element, and a preparation method and application. The raw material composition comprises the following components: a polymer elastomer resin, conductive particles, and hot melt adhesive powder. The mass ratio between the polymer elastomer resin and the hot melt adhesive powder is (4-17):(3-35); the polymer elastomer resin is a polymer elastomer resin that is initiated to be cross-linked by peroxides; and a softening point of hot melt adhesive in the hot melt adhesive powder is higher than 90°C.
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Inventors:
DENG HUA (CN)
FU QIANG (CN)
SUN CHENGXIAO (CN)
FU QIANG (CN)
SUN CHENGXIAO (CN)
Application Number:
PCT/CN2019/097874
Publication Date:
January 30, 2020
Filing Date:
July 26, 2019
Export Citation:
Assignee:
HANGZHOU SUNSCI ELECTRONIC TECH CO LTD (CN)
International Classes:
C09J153/00; C09J9/02
Foreign References:
| CN103965818A | 2014-08-06 | |||
| CN103540280A | 2014-01-29 | |||
| CN106633919A | 2017-05-10 | |||
| JPH05279644A | 1993-10-26 |
Attorney, Agent or Firm:
SHANGHAI BESHINING LAW OFFICE (CN)
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