Title:
CONDUCTIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2016/031786
Kind Code:
A1
Abstract:
A conductive adhesive sheet which comprises at least an adhesive conductive layer (X) and a non-adhesive conductive layer (Y), and wherein: the adhesive conductive layer (X) is a layer that is formed from an adhesive composition containing an adhesive resin (x1) and a carbon-based filler (x2) having an average aspect ratio of 1.5 or more; the content of the carbon-based filler (x2) contained in the adhesive composition is 0.01-15 parts by mass per 100 parts by mass of the adhesive resin (x1); and the non-adhesive conductive layer (Y) is a layer that contains one or more conductive materials selected from the group consisting of conductive polymers, carbon-based fillers and metal oxides. This conductive adhesive sheet exhibits excellent antistatic properties and electrical conductivity, while having good adhesive power.
Inventors:
OTAKA SYO (JP)
UEDA TAKAHIRO (JP)
MATSUSHITA TAIGA (JP)
MATSUSHITA KAORI (JP)
MIYATA SOU (JP)
UEDA TAKAHIRO (JP)
MATSUSHITA TAIGA (JP)
MATSUSHITA KAORI (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2015/073765
Publication Date:
March 03, 2016
Filing Date:
August 24, 2015
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B32B7/025; B32B27/00; B32B27/18; C09J7/20; C09J9/02; C09J11/04; C09J123/02; C09J123/22; C09J125/06; C09J133/00; C09J167/00; C09J201/00; H01B1/20; H01B1/24; H01B5/02; H01B5/14
Domestic Patent References:
| WO2009060687A1 | 2009-05-14 |
Foreign References:
| JP2001172582A | 2001-06-26 | |||
| JP2014001297A | 2014-01-09 | |||
| JP2010138317A | 2010-06-24 | |||
| JP2015074764A | 2015-04-20 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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