Title:
CONDUCTIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2017/104665
Kind Code:
A1
Abstract:
Provided is a conductive adhesive tape which can have improved adhesiveness while maintaining electrical characteristics, and is less likely to lift or peel even when being exposed to high temperature or high humidity after being attached. The conductive adhesive tape according to the present invention is provided with a conductive base, and an adhesive layer provided on a surface of the base, wherein the adhesive layer contains an adhesive agent and conductive particles, the conductive particles each have a base particle excluding a metal particle, and a conductive part provided on the surface of the base particle, and in the adhesive layer, the contained amount of the conductive particles is 20 parts by weight or less with respect to 100 parts by weight of the adhesive agent.
Inventors:
DATEKI MOMOKO (JP)
MARUO KOUHEI (JP)
UCHIDA NORIYUKI (JP)
MARUO KOUHEI (JP)
UCHIDA NORIYUKI (JP)
Application Number:
PCT/JP2016/087070
Publication Date:
June 22, 2017
Filing Date:
December 13, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J7/20; C09J9/02; C09J11/06; C09J201/00
Domestic Patent References:
| WO2016186099A1 | 2016-11-24 |
Foreign References:
| JP2015010110A | 2015-01-19 | |||
| JP2015010109A | 2015-01-19 | |||
| JP2004091750A | 2004-03-25 | |||
| JP2015127392A | 2015-07-09 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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