Title:
CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2008/004287
Kind Code:
A1
Abstract:
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive containing a conductive filler and a resin, characterized in that the conductive filler contains an alloy powder of silver and tin and further contains an additive including at least one member of a chelator, an antioxidant and a metal surfactant. As the additive, for example, as the chelator, a hydroxyquinoline, a salicylidene aminothiophenol or a phenanthroline, as the antioxidant, a hydroquinone or a benzotriazole, as the metal surfactant, an organic acid, an acid anhydride or an organic acid salt or the like can be used.
Inventors:
WATANABE, Bunya (Emerson & Cuming Company, 100, Kaneda, Atsugi-sh, Kanagawa 07, 2430807, JP)
渡辺 文也 (〒07 神奈川県厚木市金田１００番地 日本エイブルスティック株式会社 エマーソンアンドカミングカンパニー内 Kanagawa, 2430807, JP)
渡辺 文也 (〒07 神奈川県厚木市金田１００番地 日本エイブルスティック株式会社 エマーソンアンドカミングカンパニー内 Kanagawa, 2430807, JP)
Application Number:
JP2006/313380
Publication Date:
January 10, 2008
Filing Date:
July 05, 2006
Export Citation:
Assignee:
ABLESTIK (JAPAN) CO., LTD. (100 Kaneda, Atsugi-shi Kanagawa, 07, 2430807, JP)
日本エイブルスティック株式会社 (〒07 神奈川県厚木市金田１００番地 Kanagawa, 2430807, JP)
NAMICS CORPORATION (3993, Nigorikawa Niigata-sh, Niigata 31, 9503131, JP)
ナミックス株式会社 (〒31 新潟県新潟市濁川３９９３番地 Niigata, 9503131, JP)
日本エイブルスティック株式会社 (〒07 神奈川県厚木市金田１００番地 Kanagawa, 2430807, JP)
NAMICS CORPORATION (3993, Nigorikawa Niigata-sh, Niigata 31, 9503131, JP)
ナミックス株式会社 (〒31 新潟県新潟市濁川３９９３番地 Niigata, 9503131, JP)
International Classes:
C09J201/00; C09J9/02; H05K3/32
Attorney, Agent or Firm:
SHAMOTO, Ichio et al. (YUASA AND HARA, Section 206 New Ohtemachi Bldg.,2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 1000004, JP)
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