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Title:
CONDUCTIVE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2008/004287
Kind Code:
A1
Abstract:
It is intended to provide a conductive adhesive which does not have a problem of migration of a conductive metal upon applying voltage and exhibits a low resistance value. One embodiment of the invention relates to a conductive adhesive containing a conductive filler and a resin, characterized in that the conductive filler contains an alloy powder of silver and tin and further contains an additive including at least one member of a chelator, an antioxidant and a metal surfactant. As the additive, for example, as the chelator, a hydroxyquinoline, a salicylidene aminothiophenol or a phenanthroline, as the antioxidant, a hydroquinone or a benzotriazole, as the metal surfactant, an organic acid, an acid anhydride or an organic acid salt or the like can be used.

Inventors:
WATANABE BUNYA (JP)
TOIDA GO (JP)
Application Number:
PCT/JP2006/313380
Publication Date:
January 10, 2008
Filing Date:
July 05, 2006
Export Citation:
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Assignee:
ABLESTIK JAPAN CO LTD (JP)
NAMICS CORP (JP)
WATANABE BUNYA (JP)
TOIDA GO (JP)
International Classes:
C09J201/00; C09J9/02; H05K3/32
Foreign References:
JP2005026187A2005-01-27
JP2000309773A2000-11-07
JP2003041218A2003-02-13
JP2005194306A2005-07-21
JP2003277481A2003-10-02
JPH11197879A1999-07-27
JP2002348486A2002-12-04
JP2002100501A2002-04-05
JP2005152912A2005-06-16
JPS4959851A1974-06-11
JP2002265920A2002-09-18
US6344157B12002-02-05
US6583201B22003-06-24
Other References:
See also references of EP 2042580A4
Attorney, Agent or Firm:
SHAMOTO, Ichio et al. (Section 206 New Ohtemachi Bldg.,2-1, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, JP)
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