Title:
CONDUCTIVE ASSEMBLY, MANUFACTURING METHOD FOR SAME, AND TESTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/019642
Kind Code:
A1
Abstract:
A conductive assembly (40), a manufacturing method for same, and a testing apparatus (100). The conductive assembly (40) comprises a carrier (4) and conductive elastic bodies (43); a plurality of position-limiting holes (4a) are formed on the carrier (4); the conductive elastic bodies (43) are embedded in the position-limiting holes (4a) and are detachably connected to the carrier (4); the conductive elastic bodies (43) can be configured to be electrically connected to electronic devices (30, 20) disposed on two sides of the conductive assembly (40). According to the conductive assembly (40), after a conductive elastic body (43) is damaged, it is allowable to only replace the conductive elastic body (43), thereby greatly reducing the cost.
Inventors:
HUANG DONGYAN (CN)
CHENG ZHEN (CN)
LI ZHIXIONG (CN)
CHENG ZHEN (CN)
LI ZHIXIONG (CN)
Application Number:
PCT/CN2021/115803
Publication Date:
February 23, 2023
Filing Date:
August 31, 2021
Export Citation:
Assignee:
ZHONGSHAN LONGSYS ELECTRONICS CO LTD (CN)
International Classes:
H01R13/24
Foreign References:
| CN201556742U | 2010-08-18 | |||
| CN201160147Y | 2008-12-03 | |||
| CN2904356Y | 2007-05-23 | |||
| CN112881895A | 2021-06-01 | |||
| JP2006153529A | 2006-06-15 | |||
| US5427535A | 1995-06-27 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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