Title:
CONDUCTIVE COATED COMPOSITE BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/152017
Kind Code:
A1
Abstract:
Provided are: a conductive coated composite body which has both good adhesion of a conductive coating film to a base and excellent electrical conductivity of the conductive coating film at the same time even in cases where a glass base or a base having low heat resistance is used; and a method for producing this conductive coated composite body. A conductive coated composite body which is characterized by comprising: a base; a resin layer that is formed on at least a part of the base; and a conductive coating film that is formed on at least a part of the resin layer. This conductive coated composite body is also characterized in that: the conductive coating film is a sintered body of silver fine particles; the main component of the resin layer is a polyurethane resin having an elongation at break of 600% or more; and the polyurethane resin has one of the functional groups represented by -COO-H, -COOR, -COO-NH+R2 and -COO-NH4
+ (wherein each of R and R2 independently represents a linear or branched, optionally substituted alkyl group, a linear or branched, optionally substituted cycloalkyl group, a linear or branched, optionally substituted alkylene group, a linear or branched, optionally substituted oxyalkylene group, a linear or branched, optionally substituted aryl group, a linear or branched, optionally substituted aralkyl group, a linear or branched, optionally substituted heterocyclic group, a linear or branched, optionally substituted alkoxy group, a linear or branched, optionally substituted alkoxycarbonyl group or a linear or branched, optionally substituted acyl group).
Inventors:
TOMURA TAKUYA (JP)
SHINGAI YUUKI (JP)
SHINGAI YUUKI (JP)
Application Number:
PCT/JP2016/000884
Publication Date:
September 29, 2016
Filing Date:
February 19, 2016
Export Citation:
Assignee:
BANDO CHEMICAL IND (JP)
International Classes:
H01B5/14; B32B15/08; C09D5/02; C09D5/24; C09D7/12; C09D175/04; H01B1/00; H01B1/22; H01B13/00
Foreign References:
| JP5495465B1 | 2014-05-21 | |||
| JP2008023854A | 2008-02-07 | |||
| JP2007177103A | 2007-07-12 | |||
| JP2010165638A | 2010-07-29 | |||
| JP2013060582A | 2013-04-04 | |||
| JPH10264500A | 1998-10-06 |
Attorney, Agent or Firm:
NAKA, Koichi et al. (JP)
Relations Koichi (JP)
Relations Koichi (JP)
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