CONDUCTIVE COATING FILM-FORMING AGENT, PRODUCTION METHOD FOR SAME, AND MOLDED ARTICLE USING SAME

Title:

CONDUCTIVE COATING FILM-FORMING AGENT, PRODUCTION METHOD FOR SAME, AND MOLDED ARTICLE USING SAME

Document Type and Number:

WIPO Patent Application WO/2011/043489

Kind Code:

A1

Abstract:

Disclosed is a conductive coating film-forming agent which contains a coating film-forming component having a polyol structure, and at least one compound selected from bis(fluorosulfonyl)imide salts represented by the formula (FSO2)2N·X. The conductive coating film-forming agent remains soluble in the coating film-forming component, exhibits excellent conductivity, even under high-temperature operating conditions, is easily handled and has no environmental impact.

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Inventors:

SAKURABA Natsumi (1-6, Barajima 3-chome, Akita-sh, Akita 85, 〒0108585, JP)
櫻庭　なつみ (〒85 秋田県秋田市茨島三丁目１番６号　三菱マテリアル電子化成株式会社内 Akita, 〒0108585, JP)
HONDA Tsunetoshi (1-6, Barajima 3-chome, Akita-sh, Akita 85, 〒0108585, JP)

Application Number:

JP2010/067870

Publication Date:

April 14, 2011

Filing Date:

October 12, 2010

Export Citation:

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Assignee:

MITSUBISHI MATERIALS CORPORATION (3-2 Otemachi 1-chome, Chiyoda-ku Tokyo, 17, 〒1008117, JP)
三菱マテリアル株式会社 (〒17 東京都千代田区大手町一丁目３番２号 Tokyo, 〒1008117, JP)
Mitsubishi Materials Electronic Chemicals Co., Ltd. (1-6 Barajima 3-chome, Akita-shi Akita, 85, 〒0108585, JP)
三菱マテリアル電子化成株式会社 (〒85 秋田県秋田市茨島三丁目１番６号 Akita, 〒0108585, JP)
SAKURABA Natsumi (1-6, Barajima 3-chome, Akita-sh, Akita 85, 〒0108585, JP)

International Classes:

C09D201/06; C09D4/02; C09D5/00; C09D5/24; C09D7/12; C09D175/04; C09D175/16; H01B1/20; H01B5/14; H01B13/00