CONDUCTIVE COATING MATERIAL AND PRODUCTION METHOD FOR SHIELDED PACKAGE USING CONDUCTIVE COATING MATERIAL

WIPO Patent Application WO/2017/170398

A1

Provided are: a conductive coating material that can be sprayed to form a shield layer that has favorable shielding properties, favorably adheres to a package, and does not easily change color even under extreme heating conditions; and a production method for a shielded package that uses the conductive coating material. The present invention uses a conductive coating material that includes at least: (A) 100 parts by mass of a binder component that includes 5-30 parts by mass of a solid epoxy resin that is a solid at normal temperature and 20-90 parts by mass of a liquid epoxy resin that is a liquid at normal temperature; (B) 200-1800 parts by mass of silver-coated copper alloy particles that are copper alloy particles that have been coated with a silver-containing layer, the copper alloy particles comprising an alloy of copper, nickel, and zinc, the nickel content being 0.5-20 mass% of the silver-coated copper alloy particles, and the zinc content being 1-20 mass% of the silver-coated copper alloy particles; and (C) 0.3-40 parts by mass of a hardener.

UMEDA HIROAKI (JP)
MATSUDA KAZUHIRO (JP)
YUKAWA KEN (JP)

PCT/JP2017/012385

October 05, 2017

March 27, 2017

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TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)

C09D163/00; C09C1/66; C09C3/06; C09D4/02; C09D5/24; C09D7/12; H01B1/00; H01B1/22; H01L23/00; H01L23/28; H01L23/29; H01L23/31; H05K9/00

JP2015021145A	2015-02-02
JP2015021143A	2015-02-02
JP2014220238A	2014-11-20
JP2004047174A	2004-02-12
JP2004055543A	2004-02-19
JP2008042152A	2008-02-21
JP2011151372A	2011-08-04
JP2015115549A	2015-06-22

FUJIOKA, Takahiro (JP)

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