Title:
CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/190571
Kind Code:
A1
Abstract:
Provided is a conductive composition that can form a cured product having excellent conductive properties and adhesion to an adherend even at a lower curing temperature than is conventional. A conductive composition according to the present invention contains an epoxy compound, an imidazole compound, an amine adduct-based latent curing agent, an alkanolamine and/or aliphatic polyamine, and a metal powder, wherein: the epoxy equivalent of the epoxy compound is 100-300 g/eq; the mixed proportion of the metal powder in the conductive composition is 75-91 mass%; the imidazole compound includes an imidazole compound having a phenyl group; and 10-40 parts by mass of the imidazole compound, at least 3 parts by mass of the amine adduct-based latent curing agent, and at least 0.5 parts by mass of the alkanolamine and/or aliphatic polyamine are included relative to 100 parts by mass of the epoxy compound.
Inventors:
FUKANO JUNPEI (JP)
Application Number:
PCT/JP2023/012628
Publication Date:
October 05, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
C08G59/50; C08G59/64; C08K3/08; C08L63/00; H01B1/22
Foreign References:
| JP2014185296A | 2014-10-02 | |||
| JP2007091899A | 2007-04-12 | |||
| JP2011086397A | 2011-04-28 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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