Title:
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/093162
Kind Code:
A1
Abstract:
Disclosed is a conductive connection sheet (1) comprised of a laminated body provided with resin composition layers (11, 13) and a metal layer (12). The resin composition layers (11, 13) satisfy the following Requirement A. When the conductive connection sheet (1) having the aforementioned structure is applied to the forming of a connection portion for electrically connecting terminals to each other, heated and melted metal material can be selectively aggregated between the terminals, to form a connection portion, and a sealing layer composed of a resin component can be formed around the connection portion. Consequently, the periphery of the connection portion can be covered by a resin component and, thus, the connection portion is affixed. Furthermore, the insulation performance between the adjacent terminals is ensured by the sealing layer and, accordingly, leakage current can be reliably prevented from occurring between the adjacent terminals.
Requirement A: While at least a part of each metal ball composed of a metal material having a low melting point is disposed within the resin composition layers (11, 13), the metal ball is heated to a temperature not less than the melting temperature of the metal ball in accordance with the soldering resin flux test method prescribed in JIS Z 3197. After that, the wet extension of the metal ball is measured, and the wet extension is 37% or more.
Inventors:
KAGIMOTO TOMOHIRO (JP)
CHUMA TOSHIAKI (JP)
CHUMA TOSHIAKI (JP)
Application Number:
PCT/JP2011/050684
Publication Date:
August 04, 2011
Filing Date:
January 18, 2011
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
KAGIMOTO TOMOHIRO (JP)
CHUMA TOSHIAKI (JP)
KAGIMOTO TOMOHIRO (JP)
CHUMA TOSHIAKI (JP)
International Classes:
H01R11/01; C09D7/12; C09D201/00; H01B1/22; H01B5/16; H01L21/60; H01R4/02; H01R43/02; H05K3/32
Foreign References:
| JP2009262227A | 2009-11-12 | |||
| JP2004114104A | 2004-04-15 | |||
| JP2004244486A | 2004-09-02 | |||
| JPS61276873A | 1986-12-06 | |||
| JP2004260131A | 2004-09-16 |
Other References:
See also references of EP 2530786A4
Attorney, Agent or Firm:
ASAHI Kazuo et al. (JP)
Morning ratio One husband (JP)
Morning ratio One husband (JP)
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Claims: