CONDUCTIVE DIAPHRAGM, LOUDSPEAKER, AND METHOD FOR MANUFACTURING CONDUCTIVE DIAPHRAGM

WIPO Patent Application WO/2019/100879

A1

Disclosed are a conductive diaphragm, a loudspeaker, and a method for manufacturing the conductive diaphragm. The conductive diaphragm comprises a bent annular portion, a fixing portion and a central portion, and a conductive layer, a power supply connecting layer and a voice coil lead connecting layer are provided on the conductive diaphragm, wherein at least a part of the conductive layer is located on the bent annular portion; the power supply connecting layer and the voice coil lead connecting layer are located outside the bent annular portion; and the power supply connecting layer and the voice coil lead connecting layer are both connected to the conductive layer, and the power supply connecting layer and the voice coil lead connecting layer are both located on an outer surface of the conductive diaphragm. The voice coil lead connecting layer on the conductive diaphragm of the present disclosure may be connected to a voice coil lead of a vibrating voice coil. The voice coil lead of the present disclosure is short in wiring, thus facilitating the simplification of design and processing of the voice coil lead and eliminating a smoothing operation on the voice coil lead.

WO/2020/038229	DIAPHRAGM ASSEMBLY FOR SPEAKER AND SPEAKER HAVING THE SAME
WO/2023/036303	VIBRATION DEVICE, BONE CONDUCTION EARPHONE, WEARABLE APPARATUS, AND INTELLIGENT HARDWARE APPARATUS
JPS5848197	【考案の名称】動電形スピ-カ

WANG SUQING (CN)
WANG SHUQIANG (CN)
WU ZENGXUN (CN)

PCT/CN2018/110893

May 31, 2019

October 18, 2018

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GOERTEK INC (CN)

H04R9/02; H04R9/06

CN107809705A	2018-03-16
CN204929238U	2015-12-30
CN105872911A	2016-08-17
CN205142512U	2016-04-06
KR101467321B1	2014-12-01

BEYOND TALENT PATENT AGENT FIRM (CN)

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