Title:
CONDUCTIVE FILLER, CONDUCTIVE PASTE AND ARTICLE HAVING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2010/032841
Kind Code:
A1
Abstract:
Disclosed are a conductive filler which has excellent oxidation resistance and can be sintered easily, a conductive paste which has excellent storage stability in the air and is capable of forming a conductive film with high conductivity, and an article having conductive film with high conductivity. The conductive filler is characterized by containing a copper filler having an average aggregate particle diameter of 0.5-20 μm, copper nanoparticles having an average aggregate particle diameter of 50-200 nm and an aliphatic carboxylic acid. The conductive filler is also characterized in that the copper nanoparticles are contained in an amount of 5-50 parts by mass per 100 parts by mass of the copper filler, and the aliphatic carboxylic acid is contained in an amount of 1-15 parts by mass per 100 parts by mass of the total of the copper filler and the copper nanoparticles.
Inventors:
NAKANISHI KEI (JP)
HIRAKOSO HIDEYUKI (JP)
KOBAYASHI KAZUSHI (JP)
ABE KEISUKE (JP)
HIRAKOSO HIDEYUKI (JP)
KOBAYASHI KAZUSHI (JP)
ABE KEISUKE (JP)
Application Number:
PCT/JP2009/066420
Publication Date:
March 25, 2010
Filing Date:
September 18, 2009
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
NAKANISHI KEI (JP)
HIRAKOSO HIDEYUKI (JP)
KOBAYASHI KAZUSHI (JP)
ABE KEISUKE (JP)
NAKANISHI KEI (JP)
HIRAKOSO HIDEYUKI (JP)
KOBAYASHI KAZUSHI (JP)
ABE KEISUKE (JP)
International Classes:
H01B5/00; B22F1/00; B22F9/30; H01B1/22; H01B5/14
Domestic Patent References:
| WO2006109410A1 | 2006-10-19 |
Foreign References:
| JP2007258123A | 2007-10-04 | |||
| JP2004111168A | 2004-04-08 | |||
| JP2005183144A | 2005-07-07 | |||
| JP2004265901A | 2004-09-24 | |||
| JPH0693316A | 1994-04-05 | |||
| JP2007184143A | 2007-07-19 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
Spring name Kenji (JP)
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