Title:
CONDUCTIVE FILM AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/138003
Kind Code:
A1
Abstract:
Disclosed is a conductive film comprising a film-like base material, a conductor part extending on the main surface of the base material, and a resin part. The conductor part includes: a wiring section having a mesh-like pattern including a plurality of linear sections; and a terminal part. The terminal part has a portion having a pattern including a plurality of openings, and the portion may be a ground terminal. The resin part fills the inside of the plurality of openings in the terminal part.
Inventors:
SONODA DAISUKE (JP)
SHINGAI HIROSHI (JP)
TAMAGAWA YOSHIHISA (JP)
HARIHARA YASUMASA (JP)
GOI TOMOYUKI (JP)
TEZUKA KENICHI (JP)
SHINGAI HIROSHI (JP)
TAMAGAWA YOSHIHISA (JP)
HARIHARA YASUMASA (JP)
GOI TOMOYUKI (JP)
TEZUKA KENICHI (JP)
Application Number:
PCT/JP2021/043693
Publication Date:
June 30, 2022
Filing Date:
November 29, 2021
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01Q1/38; H01B5/14
Domestic Patent References:
| WO2020226049A1 | 2020-11-12 | |||
| WO2020009529A1 | 2020-01-09 |
Foreign References:
| US20200251813A1 | 2020-08-06 | |||
| CN111900526A | 2020-11-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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