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Patent Searching and Data


Title:
CONDUCTIVE FILM-FORMING COMPOSITION AND CONDUCTIVE FILM PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/167365
Kind Code:
A1
Abstract:
Provided is a conductive film-forming composition which contains copper particles, a copper particle fusion promoter, and a solvent, wherein the ratio MReact/MCu in the fusion promoter of the total mass MReact of the atoms which destabilize the crystal structure thereof by acting on the copper to the total mass MCu of the copper particles is 0.020-0.25. Also provided is a method for producing a conductive film which is provided with a coating film-forming step for forming a coating film by applying the conductive film-forming composition to a substrate, and a conductive film-forming step for forming a conductive film by drying the coating film at a temperature of 150°C or less.

Inventors:
OMURA KAZUFUMI (JP)
Application Number:
JP2018/043885
Publication Date:
September 06, 2019
Filing Date:
November 29, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01B1/22; C09D5/24; C09D7/20; C09D7/40; C09D7/61; C09D201/00; H01B13/00; H05K1/09; H05K3/12
Domestic Patent References:
WO2012046666A12012-04-12
Foreign References:
JP2007169770A2007-07-05
JP2015140418A2015-08-03
JP2017226912A2017-12-28
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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