CONDUCTIVE FILM HAVING EXCELLENT SOLDER WETTABILITY

Title:

CONDUCTIVE FILM HAVING EXCELLENT SOLDER WETTABILITY

Document Type and Number:

WIPO Patent Application WO/2022/085374

Kind Code:

A1

Abstract:

[Problem] The purpose of the present invention is to manufacture, at low cost with simple steps, a conductive film that suppresses lowering of solder wettability over time in cases such as when being stored for a long period of time. [Solution] This conductive film has, an a copper layer and/or a copper alloy layer formed on a film base material, a barrier layer formed of an organic compound bound to copper, and is obtained by laminating a tin plating layer on said barrier layer. Said organic compound is preferably selected from the group consisting of heterocyclic compounds, thiourea compounds, and thiol compounds.

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Inventors:

SATSUMA HIDEKI (JP)
NOSAKA TAKAYUKI (JP)
GOTO MASATOSHI (JP)

Application Number:

PCT/JP2021/035472

Publication Date:

April 28, 2022

Filing Date:

September 27, 2021

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Assignee:

SEIREN CO LTD (JP)
SATSUMA HIDEKI (JP)
NOSAKA TAKAYUKI (JP)
GOTO MASATOSHI (JP)

International Classes:

C23C28/00; C25D5/56; H01B5/14

Foreign References:

JP2014122366A	2014-07-03
JP2013008760A	2013-01-10

Attorney, Agent or Firm:

TAKANO Mifune (JP)

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