Title:
CONDUCTIVE FILM-LIKE ADHESIVE AND DICING TAPE WITH FILM-LIKE ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2015/104988
Kind Code:
A1
Abstract:
Provided are: a conductive film-like adhesive which is capable of suppressing migration and enables the production of a highly reliable semiconductor device; and a dicing tape with a film-like adhesive. The present invention is a conductive film-like adhesive which contains conductive particles and has a time from the start of a migration test based on a deionization water drop method to the occurrence of migration of 500 seconds or more. It is preferable that the film-like adhesive has a chlorine ion concentration of 20 ppm or less.
Inventors:
SUGO YUKI (JP)
ONISHI KENJI (JP)
ONISHI KENJI (JP)
Application Number:
PCT/JP2014/083936
Publication Date:
July 16, 2015
Filing Date:
December 22, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/10; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B1/22; H01L21/301; H01L21/52
Domestic Patent References:
| WO2004022663A1 | 2004-03-18 |
Foreign References:
| JPH09279121A | 1997-10-28 | |||
| JP2012142368A | 2012-07-26 | |||
| JP2013093491A | 2013-05-16 | |||
| JP2001303012A | 2001-10-31 | |||
| JP2012092247A | 2012-05-17 | |||
| JP2005276925A | 2005-10-06 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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