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Patent Searching and Data


Title:
CONDUCTIVE FILM MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/124420
Kind Code:
A1
Abstract:
The present invention pertains to a method for manufacturing a conductive film by forming a coating of a composition containing conductivity-imparting particles, and by performing photo-sintering on said coating, wherein the coating is compressed in the thickness direction thereof prior to the photo-sintering. It is preferable to compress the coating at a temperature that causes a binding agent in the composition to exhibit a storage elastic modulus of not more than 100 MPa. It is also preferable to compress the coating so as to have a compression ratio of 25-80% in the thickness direction thereof. In the photo-sintering step, the irradiation of light is preferably carried out using pulsed light.

Inventors:
ANAI, Kei (1333-2, Haraichi, Ageo-sh, Saitama 21, 〒3620021, JP)
FUKUZATO, Shun (1333-2, Haraichi, Ageo-sh, Saitama 21, 〒3620021, JP)
Application Number:
JP2018/046717
Publication Date:
June 27, 2019
Filing Date:
December 19, 2018
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO., LTD. (1-11-1 Osaki, Shinagawa-ku Tokyo, 84, 〒1418584, JP)
International Classes:
H01B13/00; C09D5/24; C09D201/00; C23C26/00; H01B1/22
Domestic Patent References:
WO2017130812A12017-08-03
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (NIKKEN AKASAKA BLDG, 7F. 5-7, Akasaka 2-chome, Minato-K, Tokyo 52, 〒1070052, JP)
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