Title:
CONDUCTIVE FILM AND METHOD FOR MANUFACTURING CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2024/004401
Kind Code:
A1
Abstract:
A conductive film (1) includes: an organic resin base material (2); an inorganic layer (3) disposed on one side in the thickness direction of the organic resin base material (2); and a copper layer (4) disposed directly on one side in the thickness direction of the inorganic layer (3). Y calculated from a predetermined relational expression is less than 23.200.
Inventors:
TAKESHITA SHOYA (JP)
SONE HIROKI (JP)
TAKEYASU TOMOHIRO (JP)
SONE HIROKI (JP)
TAKEYASU TOMOHIRO (JP)
Application Number:
PCT/JP2023/017875
Publication Date:
January 04, 2024
Filing Date:
May 12, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B9/00; B32B15/08; B32B15/20; H01B5/14; H05K1/03
Domestic Patent References:
| WO2016140073A1 | 2016-09-09 | |||
| WO2017104573A1 | 2017-06-22 |
Foreign References:
| JP2016068470A | 2016-05-09 | |||
| JP2015133256A | 2015-07-23 | |||
| JPH06333925A | 1994-12-02 |
Attorney, Agent or Firm:
IKUMI PATENT ATTORNEYS OFFICE (JP)
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