Title:
CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, CONDUCTOR, RESIST PATTERN FORMATION METHOD, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2019/177096
Kind Code:
A1
Abstract:
This conductive film comprises a conductive polymer (A), and has a film thickness of 35 nm or less. The surface resistance of the conductive film is 1×1011Ω/□ or less, and the standard deviation of the value of current flowing in the conductive film when a voltage is applied to the conductive film is 5 or less. The conductor according to the present invention comprises a base material and the conductive film provided on at least a portion of the surface of the base material. The resist pattern formation method according to the present invention comprises: a lamination step for forming the conductive film on the surface of a resist layer of a substrate having on one surface said resist layer comprising a chemically amplified resist material; and an exposure step for irradiating the substrate with an electron beam in a pattern shape from the conductive film side. The laminate according to the present invention comprises a resist layer and an antistatic film formed on the surface of the resist layer, and the antistatic film is the conductive film.
Inventors:
MAKIGAWA SAKI (JP)
YAMAZAKI AKIRA (JP)
YAMADA NAOKO (JP)
IRIE YOSHIKO (JP)
SAIKI SHINJI (JP)
UZAWA MASASHI (JP)
YAMAZAKI AKIRA (JP)
YAMADA NAOKO (JP)
IRIE YOSHIKO (JP)
SAIKI SHINJI (JP)
UZAWA MASASHI (JP)
Application Number:
PCT/JP2019/010536
Publication Date:
September 19, 2019
Filing Date:
March 14, 2019
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
H01B1/12; C08G73/00; G03F7/11; G03F7/20; H01B5/14; H01B13/00; H01L21/027
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Other References:
See also references of EP 3767639A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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