Title:
CONDUCTIVE FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/056722
Kind Code:
A1
Abstract:
A preparation method for a conductive film, comprising: coating a layer of curing adhesive on a substrate (1) to form a curing adhesive layer (2) (S1); providing a mold (5) having a protrusion (51) (S2); transferring the liquid at a seed layer onto the protrusion (51) (S3); stamping the curing adhesive layer (2) using the mold (5) (S4); curing to form a pattern groove (21) and forming a seed layer (3) below the bottom of the pattern groove (21) (S5); demolding (S6); and preparing a conductive layer (4) in the pattern groove (21) (S7). Also disclosed is a conductive film, comprising: a substrate (1), a curing adhesive layer (2) provided on the surface of the substrate (1) and having a pattern groove (21), a seed layer (3), and a conductive layer (4). The conductive layer (4) is provided in the pattern groove (21). The seed layer (3) is provided below the bottom of the pattern groove (21) before the curing adhesive layer (2) is formed. By transferring the liquid at the seed layer onto the protrusion (51), forming the pattern groove (21) on the curing adhesive layer (2), and forming the seed layer (3) below the bottom of the pattern groove (21), the conductive layer (4) prepared in the pattern groove (21) has lower resistance than a conductive layer prepared by scrape coating, and thus the conductivity of the conductive film is better.
Inventors:
JI LIANGLIANG (CN)
ZHOU XIAOHONG (CN)
ZHOU XIAOHONG (CN)
Application Number:
PCT/CN2019/117129
Publication Date:
April 01, 2021
Filing Date:
November 11, 2019
Export Citation:
Assignee:
IVTOUCH CO LTD (CN)
International Classes:
G06F3/041; H01B13/00; H01B5/14
Foreign References:
| CN109885206A | 2019-06-14 | |||
| KR20170091406A | 2017-08-09 | |||
| CN108456875A | 2018-08-28 | |||
| CN105139963A | 2015-12-09 | |||
| US20050238967A1 | 2005-10-27 |
Attorney, Agent or Firm:
SUZHOU JINHE INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
Download PDF: