Title:
CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2012/011491
Kind Code:
A1
Abstract:
Disclosed is a conductive film that, without wiring disconnections, can achieve both an increased minuteness of conductor width and a reduced resistance, and wherein a conductor pattern is formed with high adhesion without particular regard to substrate type. The conductive film is provided with: a substrate; a receiving layer provided to the aforementioned substrate; and a conductor pattern that has a conductor width of no greater than 30 µm and that is formed by printing onto the aforementioned receiving layer a conductive paste containing a binder resin and conductive particles having an average particle size (D50) of no greater than 2 µm. In the direction of thickness of the aforementioned conductor pattern, at least a portion of the aforementioned conductor pattern is sunk into the aforementioned receiving layer.
Inventors:
KUWABARA, Shin (1048, Oaza-Kadoma, Kadoma-sh, Osaka 86, 〒5718686, JP)
Application Number:
JP2011/066435
Publication Date:
January 26, 2012
Filing Date:
July 20, 2011
Export Citation:
Assignee:
PANASONIC ELECTRIC WORKS CO., LTD. (1048, Oaza-Kadoma Kadoma-sh, Osaka 86, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
パナソニック電工株式会社 (〒86 大阪府門真市大字門真１０４８番地 Osaka, 〒5718686, JP)
International Classes:
H05K3/12; H01B5/14; H05K1/09
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (Hokuto Patent Attorneys Office, Umeda Square Bldg. 9F., 12-17, Umeda 1-chome, Kita-ku, Osaka-sh, Osaka 01, 〒5300001, JP)
Claims: