Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2017/082270
Kind Code:
A1
Abstract:
Provided is a conductive film that is conductive in the planar direction, is deformable, has excellent durability, and transmits visible light. The conductive film (10, 70, 90) comprises a film substrate (11, 71) and a conductive material layer (12, 80). The conductive material layer (12, 80) is provided on a first substrate surface (11a, 71a) of the film substrate (11, 71). The conductive film (10, 70, 90) has formed therein a plurality of through holes (13, 75) that pass through the film substrate (11, 71) and the conductive material layer (12, 80) in the thickness direction. The conductive material layer (12, 80) has a plurality of conductive parts (22). Each conductive part (22) is between adjacent layer openings (21). There are at least 400 conductive parts (22) per 1 mm2, and the open area ratio of the conductive material layer (12, 80) is at least 40%.

More Like This:
WO/2017/026426POROUS PARTICLE MADE OF ORGANIC POLYMER, METHOD FOR PRODUCING POROUS PARTICLE MADE OF ORGANIC POLYMER, AND BLOCK COPOLYMER
JP7171607microfibrillated cellulose foam
Inventors:
ITO KOJU (JP)
KOHASHI SOUICHI (JP)
YABU HIROSHI (JP)
NAGAMINE KUNIAKI (JP)
NISHIZAWA MATSUHIKO (JP)
Application Number:
PCT/JP2016/083170
Publication Date:
May 18, 2017
Filing Date:
November 09, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08J9/26; B32B7/02; C08J9/36; H01B5/14; H05K9/00
Foreign References:
JP2014124906A2014-07-07
JP2006070254A2006-03-16
JP2007291367A2007-11-08
JP2004276443A2004-10-07
JP2009073124A2009-04-09
JP2014212211A2014-11-13
Attorney, Agent or Firm:
KYORITSU INSTITUTE (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND LAMINATE

Next Patent: FOAMING MEMBER