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Patent Searching and Data


Title:
CONDUCTIVE INK AND CARBON WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/203417
Kind Code:
A1
Abstract:
[Problem] Provided is an inexpensive carbon wiring board having both high environmental resistance and a wide distortion detection range. [Solution] According to the present invention, this carbon wiring board has a wiring pattern formed from a conductive ink characterized by containing a carbonaceous conductive material (A), a binder resin (B) containing a solvent-soluble polyimide, and a solvent (C), wherein 0.5-40 parts by mass of the binder resin (B) is contained with respect to 100 parts by mass of the carbonaceous conductive material.

Inventors:
ARAKI TEPPEI (JP)
SEKITANI TSUYOSHI (JP)
KUWAHARA JUN (JP)
ISHII NOBUAKI (JP)
OHATA HIDEKI (JP)
Application Number:
PCT/JP2020/012742
Publication Date:
October 08, 2020
Filing Date:
March 23, 2020
Export Citation:
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Assignee:
UNIV OSAKA (JP)
SHOWA DENKO KK (JP)
International Classes:
C09D11/102; C09D11/52; H01B1/24; H01B5/14
Foreign References:
JP2018163877A2018-10-18
US20170200539A12017-07-13
JPH08295838A1996-11-12
JP2016027463A2016-02-18
JPH11241903A1999-09-07
JPH01108276A1989-04-25
JP2007066743A2007-03-15
JP2006225454A2006-08-31
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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