Title:
CONDUCTIVE MATERIAL AND CONNECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/179532
Kind Code:
A1
Abstract:
Provided is a conductive material which is capable of efficiently arranging a solder between electrodes to be connected, thereby being capable of enhancing the conduction reliability and insulation reliability.
A conductive material according to the present invention comprises: a plurality of first conductive particles, each of which contains a solder in an outer surface portion of a conductive part; second conductive particles, each of which contains silver, ruthenium, iridium, gold, palladium or platinum in an outer surface portion of a conductive part; a thermosetting compound; and a thermal curing agent.
Inventors:
KUBOTA TAKASHI (JP)
NISHIOKA KEIZO (JP)
NISHIOKA KEIZO (JP)
Application Number:
PCT/JP2017/014656
Publication Date:
October 19, 2017
Filing Date:
April 10, 2017
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; H01B1/00; H01L21/60; H05K1/14; H05K3/32; B23K35/26; B23K35/363; C22C13/00
Domestic Patent References:
WO2016043265A1 | 2016-03-24 |
Foreign References:
JP2008243391A | 2008-10-09 | |||
JP2005353781A | 2005-12-22 | |||
JP2012250240A | 2012-12-20 | |||
JP2014017248A | 2014-01-30 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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