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Patent Searching and Data


Title:
CONDUCTIVE MATERIAL AND CONNECTING BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/188372
Kind Code:
A1
Abstract:
Provided are an anisotropic conductive adhesive with which it is possible to obtain high connection reliability even in the case of pressure bonding under a low pressure condition, and a connecting body manufacturing method. The anisotropic conductive adhesive contains an insulating adhesive and resin core conductive particles having a 20% compression recovery rate of 20% or more and a compression hardness K-value of 4000 N/mm2 or more during 20% compression. This makes it possible that the conductive particles break through an oxide layer even in the case of pressure bonding under a low pressure condition, similarly to the case of pressure bonding under a high pressure condition, thereby making it possible to obtain high connection reliability.

Inventors:
KITADUME, Koji (Gate City Osaki East Tower 8F, 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
EJIMA, Koji (Gate City Osaki East Tower 8F, 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
Application Number:
JP2019/010673
Publication Date:
October 03, 2019
Filing Date:
March 14, 2019
Export Citation:
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Assignee:
DEXERIALS CORPORATION (Gate City Osaki, East Tower 8F 1-11-2, Osaki, Shinagawa-k, Tokyo 32, 〒1410032, JP)
International Classes:
H01B1/22; C09J5/00; C09J7/10; C09J7/35; C09J9/02; C09J11/04; C09J163/00; C09J201/00; H01B1/00; H01B5/16; H01L21/60
Domestic Patent References:
WO2014007334A12014-01-09
WO2017191776A12017-11-09
Foreign References:
JP2017069191A2017-04-06
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (Elevage Kandanishikicho 2F, 3-16-11 Kandanishikicho, Chiyoda-k, Tokyo 54, 〒1010054, JP)
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