Title:
CONDUCTIVE MATERIAL AND CONNECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2013/146604
Kind Code:
A1
Abstract:
The present invention provides a conductive material capable of reducing the connection resistance in a connecting structure obtained when an electrical connection is established between electrodes to yield the connecting structure. This conductive material contains a binder resin, and conductive particles having solder on a conductive surface. The binder resin includes a curing compound that hardens through heating, and a thermosetting agent. When the binder resin and the solder in the conductive particles are heated at a rate of temperature rise of 10°C/minute and differential scanning calorimetry is performed, an exothermic peak top P1t temperature in the curing of the binder resin is lower than the endothermic peak top P2t temperature in the molten solder.
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Inventors:
ISHIZAWA HIDEAKI (JP)
KUBOTA TAKASHI (JP)
KUBOTA TAKASHI (JP)
Application Number:
PCT/JP2013/058346
Publication Date:
October 03, 2013
Filing Date:
March 22, 2013
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01R11/01
Domestic Patent References:
| WO2011132658A1 | 2011-10-27 |
Foreign References:
| JP2013033735A | 2013-02-14 | |||
| JP2012019203A | 2012-01-26 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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